Processing a memory link with a set of at least two laser pulses

ABSTRACT

A set ( 50 ) of laser pulses ( 52 ) is employed to sever a conductive link ( 22 ) in a memory or other IC chip. The duration of the set ( 50 ) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse ( 52 ) within the set ( 50 ) is preferably within a range of about 0.1 ps to 30 ns. The set ( 50 ) can be treated as a single “pulse” by conventional laser positioning systems ( 62 ) to perform on-the-fly link removal without stopping whenever the laser system ( 60 ) fires a set ( 50 ) of laser pulses ( 52 ) at each link ( 22 ). Conventional IR wavelengths or their harmonics can be employed.

RELATED APPLICATIONS

This patent application is a continuation of U.S. patent applicationSer. No. 10/322,347, filed Dec. 17, 2002, which claims priority fromU.S. Provisional Application No. 60/341,744, filed Dec. 17, 2001, and isa continuation-in-part of U.S. patent application Ser. No. 09/757,418,filed Jan. 9, 2001, now U.S. Pat. No. 6,574,250, which claims priorityfrom both U.S. Provisional Application No. 60/223,533, filed Aug. 4,2000, and U.S. Provisional Application No. 60/175,337, filed Jan. 10,2000.

TECHNICAL FIELD

The present invention relates to laser processing of memory or other IClinks and, in particular, to a laser system and method employing a setof at least two laser pulses to sever an IC link on-the-fly.

BACKGROUND OF THE INVENTION

Yields in IC device fabrication processes often incur defects resultingfrom alignment variations of subsurface layers or patterns orparticulate contaminants. FIGS. 1, 2A, and 2B show repetitive electroniccircuits 10 of an IC device or work piece 12 that are commonlyfabricated in rows or columns to include multiple iterations ofredundant circuit elements 14, such as spare rows 16 and columns 18 ofmemory cells 20. With reference to FIGS. 1, 2A, and 2B, circuits 10 arealso designed to include particular laser severable conductive links 22between electrical contacts 24 that can be removed to disconnect adefective memory cell 20, for example, and substitute a replacementredundant cell 26 in a memory device such as a DRAM, an SRAM, or anembedded memory. Similar techniques are also used to sever links toprogram a logic product, gate arrays, or ASICs.

Links 22 are about 0.3-2 microns (μm) thick and are designed withconventional link widths 28 of about 0.4-2.5 μm, link lengths 30, andelement-to-element pitches (center-to-center spacings) 32 of about 2-8μm from adjacent circuit structures or elements 34, such as linkstructures 36. Although the most prevalent link materials have beenpolysilicon and like compositions, memory manufacturers have morerecently adopted a variety of more conductive metallic link materialsthat may include, but are not limited to, aluminum, copper, gold,nickel, titanium, tungsten, platinum, as well as other metals, metalalloys, metal nitrides such as titanium or tantalum nitride, metalsilicides such as tungsten silicide, or other metal-like materials.

Circuits 10, circuit elements 14, or cells 20 are tested for defects,the locations of which may be mapped into a database or program.Traditional 1.047 μm or 1.064 μm infrared (IR) laser wavelengths havebeen employed for more than 20 years to explosively remove conductivelinks 22. Conventional memory link processing systems focus a singlepulse of laser output having a pulse width of about 4 to 30 nanoseconds(ns) at each link 22. FIGS. 2A and 2B show a laser spot 38 of spot size(area or diameter) 40 impinging a link structure 36 composed of apolysilicon or metal link 22 positioned above a silicon substrate 42 andbetween component layers of a passivation layer stack including anoverlying passivation layer 44 (shown in FIG. 2A but not in FIG. 2B),which is typically 500-10,000 angstrom (A) thick, and an underlyingpassivation layer 46. Silicon substrate 42 absorbs a relatively smallproportional quantity of IR radiation, and conventional passivationlayers 44 and 46 such as silicon dioxide or silicon nitride arerelatively transparent to IR radiation. The links 22 are typicallyprocessed “on-the-fly” such that the beam positioning system does nothave to stop moving when a laser pulse is fired at a link 22, with eachlink 22 being processed by a single laser pulse. The on-the-fly processfacilitates a very high link-processing throughput, such as processingseveral tens of thousands of links 22 per second.

FIG. 2C is a fragmentary cross-sectional side view of the link structureof FIG. 2B after the link 22 is removed by the prior art laser pulse. Toavoid damage to the substrate 42 while maintaining sufficient energy toprocess a metal or nonmetal link 22, Sun et al. in U.S. Pat. No.5,265,114 and U.S. Pat. No. 5,473,624 proposed using a single 9 to 25 nspulse at a longer laser wavelength, such as 1.3 μm, to process memorylinks 22 on silicon wafers. At the 1.3 μm laser wavelength, theabsorption contrast between the link material and silicon substrate 42is much larger than that at the traditional 1 μm laser wavelengths. Themuch wider laser processing window and better processing qualityafforded by this technique has been used in the industry for about fiveyears with great success.

The 1.0 μm and 1.3 μm laser wavelengths have disadvantages however. Thecoupling efficiency of such IR laser beams 12 into a highly electricallyconductive metallic link 22 is relatively poor; and the practicalachievable spot size 40 of an IR laser beam for link severing isrelatively large and limits the critical dimensions of link width 28,link length 30 between contacts 24, and link pitch 32. This conventionallaser link processing relies on heating, melting, and evaporating link22, and creating a mechanical stress build-up to explosively openoverlying passivation layer 44 with a single laser pulse. Such aconventional link processing laser pulse creates a large heat affectedzone (HAZ) that could deteriorate the quality of the device thatincludes the severed link. For example, when the link is relativelythick or the link material is too reflective to absorb an adequateamount of the laser pulse energy, more energy per laser pulse has to beused. Increased laser pulse energy increases the damage risk to the ICchip. However, using a laser pulse energy within the risk-free range onthick links often results in incomplete link severing.

U.S. Pat. No. 6,057,180 of Sun et al. and U.S. Pat. No. 6,025,256 ofSwenson et al. more recently describe methods of using ultraviolet (UV)laser output to sever or expose links that “open” the overlyingpassivation by different material removal mechanisms and have thebenefit of a smaller beam spot size. However, removal of the link itselfby such a UV laser pulse entails careful consideration of the underlyingpassivation structure and material to protect the underlying passivationand silicon wafer from being damaged by the UV laser pulse.

U.S. Pat. No. 5,656,186 of Mourou et al. discloses a general method oflaser induced breakdown and ablation at several wavelengths by highrepetition rate ultrafast laser pulses, typically shorter than 10 ps,and demonstrates creation of machined feature sizes that are smallerthan the diffraction limited spot size.

U.S. Pat. No. 5,208,437 of Miyauchi et al. discloses a method of using asingle “Gaussian”-shaped pulse of a subnanosecond pulse width to processa link.

U.S. Pat. No. 5,742,634 of Rieger et al. discloses a simultaneouslyQ-switched and mode-locked neodymium (Nd) laser device with diodepumping. The laser emits a series of pulses each having a duration timeof 60 to 300 picoseconds (ps), under an envelope of a time duration of100 ns.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method or apparatusfor improving the quality of laser processing of IC links.

Another object of the invention is to process a link with a set of lowenergy laser pulses.

A further object of the invention is to process a link with a set of lowenergy laser pulses at a shorter wavelength.

Yet another object of the invention is to employ such sets of laserpulses to process links on-the-fly.

The present invention employs a set of at least two laser pulses, eachwith a laser pulse energy within a safe range, to sever an IC link,instead of using a single laser pulse of conventional link processingsystems. This practice does not, however, entail either a long dwelltime or separate duplicative scanning passes of repositioning andrefiring at each link that would effectively reduce the throughput byfactor of about two. The duration of the set is preferably shorter than1,000 ns, more preferably shorter than 500 ns, most preferably shorterthan 300 ns and preferably in the range of 5 to 300 ns; and the pulsewidth of each laser pulse within the set is generally in the range of100 femtoseconds (fs) to 30 ns. Each laser pulse within the set has anenergy or peak power per pulse that is less than the damage thresholdfor the silicon substrate supporting the link structure. The number oflaser pulses in the set is controlled such that the last pulse cleansoff the bottom of the link leaving the underlying passivation layer andthe substrate intact. Because the whole duration of the set is shorterthan 1,000 ns, the set is considered to be a single “pulse” by atraditional link-severing laser positioning system. The laser spot ofeach of the pulses in the set encompasses the link width and thedisplacement between the laser spots of each pulse is less than thepositioning accuracy of a typical positioning system, which is typically+−0.05 to 0.2 μm. Thus, the laser system can still process linkson-the-fly, i.e. the positioning system does not have to stop movingwhen the laser system fires a set of laser pulses at each selected link.

In one embodiment, a continuous wave (CW) mode-locked laser at highlaser pulse repetition rate, followed by optical gate and an amplifier,generates sets having ultrashort laser pulses that are preferably fromabout 100 fs to about 10 ps. In another one embodiment, a Q-switched andCW mode-locked laser generates sets having ultrashort laser pulses thatare preferably from about 100 fs to about 10 ps. Because each laserpulse within the burst set is ultrashort, its interaction with thetarget materials (passivation layers and metallic link) is substantiallynot thermal. Each laser pulse breaks off a thin sublayer of about100-2,000 Å of material, depending on the laser energy or peak power,laser wavelength, and type of material, until the link is severed. Thissubstantially nonthermal process may mitigate certain irregular andinconsistent link processing quality associated with thermal-stressexplosion behavior of passivation layers 44 of links 22 with widthsnarrower than about 1 μm. In addition to the “nonthermal” andwell-controllable nature of ultrashort-pulse laser processing, the mostcommon ultrashort-pulse laser source emits at a wavelength of about 800nm and facilitates delivery of a small-sized laser spot. Thus, theprocess may facilitate greater circuit density.

In another embodiment, the sets have laser pulses that are preferablyfrom about 25 ps to about 20 ns or 30 ns. These sets of laser pulses canbe generated from a CW mode-locked laser system including an opticalgate and an optional down stream amplifier, from a step-controlledacousto-optic (A-O) Q-switched laser system, from a laser systememploying a beam splitter and an optical delay path, or from two or moresynchronized but offset lasers that share a portion of an optical path.

Additional objects and advantages of this invention will be apparentfrom the following detailed description of preferred embodiments, whichproceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a portion of a DRAM showing theredundant layout of and programmable links in a spare row of genericcircuit cells.

FIGS. 2A and 2A ₁ are fragmentary cross-sectional side views ofconventional, large semiconductor link structures, respectively with andwithout an underlying passivation layer, receiving a laser pulsecharacterized by prior art pulse parameters.

FIG. 2B is a fragmentary top view of the link structure and the laserpulse of FIG. 2A, together with an adjacent circuit structure.

FIG. 2C is a fragmentary cross-sectional side view of the link structureof FIG. 2B after the link is removed by the prior art laser pulse.

FIG. 3 shows a power versus time graph of exemplary sets of constantamplitude laser pulses employed to sever links in accordance with thepresent invention.

FIG. 4 shows a power versus time graph of alternative exemplary sets ofmodulated amplitude laser pulses employed to sever links in accordancewith the present invention.

FIG. 5 shows a power versus time graph of other alternative exemplarysets of modulated amplitude laser pulses employed to sever links inaccordance with the present invention.

FIG. 6 is a partly schematic, simplified diagram of an embodiment of anexemplary green laser system including a work piece positioner thatcooperates with a laser processing control system for practicing themethod of the present invention.

FIG. 7 is a simplified schematic diagram of one laser configuration thatcan be employed to implement the present invention.

FIG. 8 is a simplified schematic diagram of an alternative embodiment ofa laser configuration that can be employed to implement the presentinvention.

FIG. 9 shows a power versus time graph of alternative exemplary sets ofmodulated amplitude laser pulses employed to sever links in accordancewith the present invention.

FIG. 10A shows a power versus time graph of a typical single laser pulseemitted by a conventional laser system to sever a link.

FIG. 10B shows a power versus time graph of an exemplary set of laserpulses emitted by a laser system with a step-controlled Q-switch tosever a link.

FIG. 11 is a power versus time graph of an exemplary RF signal appliedto a step-controlled Q-switch.

FIG. 12 is a power versus time graph of exemplary laser pulses that canbe generated through a step-controlled Q-switch employing the RF signalshown in FIG. 11.

FIG. 13 is a simplified schematic diagram of an alternative embodimentof a laser system that can be employed to implement the presentinvention.

FIGS. 14A-14D show respective power versus time graphs of an exemplarylaser pulses propagating along separate optical paths of the lasersystem shown in FIG. 14.

FIG. 15 is a simplified schematic diagram of an alternative embodimentof a laser system that employs two or more lasers to implement thepresent invention.

FIGS. 16A-16C show respective power versus time graphs of exemplarylaser pulses propagating along separate optical paths of the lasersystem shown in FIG. 16.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIGS. 3-5, 9, 10B, 12, 14D, and 16C show power versus time graphs ofexemplary sets 50 a, 50 b, 50 c,50 d, 50 e, 50 f, and 50 g (genericallysets 50) of laser pulses 52 a, 52 b ₁-52 b ₈, 52 c ₁-52 c ₅, 52 d ₁-52 d₃, 52 e ₁-52 e ₄, 52 f ₁-52 f ₂, and 52 g ₁-52 g ₂ (generically laserpulses 52) employed to sever links 22 in accordance with the presentinvention. Preferably, each set 50 severs a single link 22. Preferredsets 50 include 2 to 50 pulses 52. The duration of each set 50 ispreferably shorter than about 1000 ns, more preferably shorter than 500ns, and most preferably in the range of about 5 ns to 300 ns. Sets 50are time-displaced by a programmable delay interval that is typicallyshorter than 0.1 millisecond and may be a function of the speed of thepositioning system 62 and the distance between the links 22 to beprocessed. The pulse width of each laser pulse 52 within set 50 is inthe range of about 100 fs to about 30 ns.

During a set 50 of laser pulses 52, each laser pulse 52 has insufficientheat, energy, or peak power to fully sever a link 22 or damage theunderlying substrate 42 but removes a part of link 22 and/or anyoverlying passivation layer 44. At a preferred wavelength from about 150nm to about 1320 nm, preferred ablation parameters of focused spot size40 of laser pulses 52 include laser energies of each laser pulse betweenabout 0.005 μJ to about 1 μJ (and intermediate energy ranges between0.01 μJ to about 0.5 μJ) and laser energies of each set between 0.01 μJto about 2 μJ and at greater than about 1 Hz, and preferably 1 kHz to 40kHz or higher. The focused laser spot diameter is preferably 50% to 100%larger than the width of the link 22, depending on the link width 28,link pitch size 32, link material and other link structure and processconsiderations.

Depending on the wavelength of laser output and the characteristics ofthe link material, the severing depth of pulses 52 applied to link 22can be accurately controlled by choosing the energy of each pulse 52 andthe number of laser pulses 52 in each set 50 to clean off the bottom ofany given link 22, leaving underlying passivation layer 46 relativelyintact and substrate 42 undamaged. Hence, the risk of damage to siliconsubstrate 42 is substantially eliminated, even if a laser wavelength inthe UV range is used.

The energy density profile of each set 50 of laser pulses 52 can becontrolled better than the energy density profile of a conventionalsingle link-severing laser pulse. With reference to FIG. 3, each laserpulse 52 a can be generated with the same energy density to provide apulse set 50 a with a consistent “flat-top” energy density profile. Set50 a can, for example, be accomplished with a mode-locked laser followedby an electro-optic (E-O) or acousto-optic (A-O) optical gate and anoptional amplifier (FIG. 8).

With reference to FIG. 4, the energy densities of pulses 52 b ₁-52 b ₈(generically 52 b) can be modulated so that sets 50 b of pulses 52 b canhave almost any predetermined shape, such as the energy density profileof a conventional link-blowing laser pulse with a gradual increase anddecrease of energy densities over pulses 52 b ₁-52 b ₈. Sets 50 b can,for example, be accomplished with a simultaneously Q-switched and CWmode-locked laser system 60 shown in FIG. 6. Sequential sets 50 may havedifferent peak power and energy density profiles, particularly if links22 with different characteristics are being processed.

FIG. 5 shows an alternative energy density profile of pulses 52 c ₁-52 c₅ (generically 52 c) that have sharply and symmetrically increasing anddecreasing over sets 50 c. Sets 50 c can be accomplished with asimultaneously Q-switched and CW mode-locked laser system 60 shown inFIG. 6.

Another alternative set 50 that is not shown has initial pulses 52 withhigh energy density and trailing pulses 52 with decreasing energydensity. Such an energy density profile for a set 50 would be useful toclean out the bottom of the link without risk of damage to aparticularly sensitive work piece.

FIG. 6 shows a preferred embodiment of a simplified laser system 60including a Q-switched and/or CW mode-locked laser 64 for generatingsets 50 of laser pulses 52 desirable for achieving link severing inaccordance with the present invention. Preferred laser wavelengths fromabout 150 nm to about 2000 nm include, but are not limited to, 1.3,1.064, or 1.047, 1.03-1.05, 0.75-0.85 μm or their second, third, fourth,or fifth harmonics from Nd:YAG, Nd:YLF, Nd:YVO₄, Yb:YAG, or Ti:Sapphirelasers 64. Skilled persons will appreciate that lasers emitting at othersuitable wavelengths are commercially available, including fiber lasers,and could be employed.

Laser system 60 is modeled herein only by way of example to a secondharmonic (532 nm) Nd:YAG laser 64 since the frequency doubling elementscan be removed to eliminate the harmonic conversion. The Nd:YAG or othersolid-state laser 64 is preferably pumped by a laser diode 70 or a laserdiode-pumped solid-state laser, the emission 72 of which is focused bylens components 74 into laser resonator 82. Laser resonator 82preferably includes a lasant 84, preferably with a short absorptionlength, and a Q-switch 86 positioned between focusing/folding mirrors 76and 78 along an optic axis 90. An aperture 100 may also be positionedbetween lasant 84 and mirror 78. Mirror 76 reflects light to mirror 78and to a partly reflective output coupler 94 that propagates laseroutput 96 along optic axis 98. Mirror 78 is adapted to reflect a portionof the light to a semiconductor saturable absorber mirror device 92 formode locking the laser 64. A harmonic conversion doubler 102 ispreferably placed externally to resonator 82 to convert the laser beamfrequency to the second harmonic laser output 104. Skilled persons willappreciate that where harmonic conversion is employed, a gating device106, such as an E-O or A-O device can be positioned before the harmonicconversion apparatus to gate or finely control the harmonic laser pulseenergy.

Skilled persons will appreciate that any of the second, third, or fourthharmonics of Nd:YAG (532 mm, 355 mm, 266 mm); Nd:YLF (524 mm, 349 nm,262 nm) or the second harmonic of Ti:Sapphire (375-425 mm) can beemployed to preferably process certain types of links 22 usingappropriate well-known harmonic conversion techniques. Harmonicconversion processes are described in pp. 138-141, V. G. Dmitriev, et.al., “Handbook of Nonlinear Optical Crystals”, Springer-Verlag, NewYork, 1991 ISBN 3-540-53547-0.

An exemplary laser 64 can be a mode-locked Ti-Sapphire ultrashort pulselaser with a laser wavelength in the near IR range, such as 750-850 mm.Spectra Physics makes a Ti-Sapphire ultra fast laser called the MAI TAI™which provides ultrashort pulses 52 having a pulse width of 100femtoseconds (fs) at 1 W of power in the 750 to 850 mm range at arepetition rate of 80 MHz. This laser 64 is pumped by a diode-pumped,frequency-doubled, solid-state green YAG laser (5 W or 10 W). Otherexemplary ultrafast Nd:YAG or Nd:YLF lasers 64 include theJAGUAR-QCW-1000™ and the JAGUAR-CW-250™ sold by Time-Bandwidth® ofZurich, Switzerland.

FIG. 7 shows a schematic diagram of a simplified alternativeconfiguration of a laser system 108 for employing the present invention.Skilled persons will appreciate that for harmonically converted greenand longer wavelength light, the E-O device 106 is preferably positionedafter the harmonic conversion converter 102.

FIG. 8 shows a schematic diagram of another simplified alternativeconfiguration of a laser system 110 for that employs an amplifier 112.

Skilled person will appreciate that a Q-switched laser 64 without CWmode-locking is preferred for several embodiments, particularly forapplications employing pulse widths greater than 0.1 ps. Such lasersystems 60 does not employ a saturable absorber and optical paths 90 and98 are collinear. Such alternative laser systems 60 are commerciallyavailable and well known to skilled practitioners.

Laser output 104 (regardless of wavelength or laser type) can bemanipulated by a variety of conventional optical components 116 and 118that are positioned along a beam path 120. Components 116 and 118 mayinclude a beam expander or other laser optical components to collimatelaser output 104 to produce a beam with useful propagationcharacteristics. One or more beam reflecting mirrors 122, 124, 126 and128 are optionally employed and are highly reflective at the laserwavelength desired, but highly transmissive at the unused wavelengths,so only the desired laser wavelength will reach link structure 36. Afocusing lens 130 preferably employs an F1, F2, or F3 single componentor multicomponent lens system that focuses the collimated pulsed lasersystem output 140 to produce a focused spot size 40 that is greater thanthe link width 28, encompasses it, and is preferably less than 2 μm indiameter or smaller depending on the link width 28 and the laserwavelength.

A preferred beam positioning system 62 is described in detail in U.S.Pat. No. 4,532,402 of Overbeck. Beam positioning system 62 preferablyemploys a laser controller 160 that controls at least two platforms orstages (stacked or split-axis) and coordinates with reflectors 122, 124,126, and 128 to target and focus laser system output 140 to a desiredlaser link 22 on IC device or work piece 12. Beam positioning system 62permits quick movement between links 22 on work piece 12 to effectunique link-severing operations on-the-fly based on provided test ordesign data.

The position data preferably direct the focused laser spot 38 over workpiece 12 to target link structure 36 with one set 50 of laser pulses 52of laser system output 140 to remove link 22. The laser system 60preferably severs each link 22 on-the-fly with a single set 50 of laserpulses 52 without stopping the beam positioning system 62 over any link22, so high throughput is maintained. Because the sets 50 are less thanabout 1,000 ns, each set 50 is treated like a single pulse bypositioning system 62, depending on the scanning speed of thepositioning system 62. For example, if a positioning system 62 has ahigh speed of about 200 mm per second, then a typical displacementbetween two consecutive laser spots 38 with interval time of 1,000 nsbetween them would be typically less than 0.2 μm and preferably lessthen 0.06 μm during a preferred time interval of set 50, so two or moreconsecutive spots 38 would substantially overlap and each of the spots38 would completely cover the link width 28. In addition to control ofthe repetition rate, the time offset between the initiation of pulses 52within a set 50 is typically less than 1,000 ns and preferably betweenabout 5 ns and 500 ns and can also be programmable by controllingQ-switch stepping, laser synchronization, or optical path delaytechniques as later described.

Laser controller 160 is provided with instructions concerning thedesired energy and pulse width of laser pulses 52, the number of pulses52, and/or the shape and duration of sets 50 according to thecharacteristics of link structures 36. Laser controller 160 may beinfluenced by timing data that synchronizes the firing of laser system60 to the motion of the platforms such as described in U.S. Pat. No.5,453,594 of Konecny for Radiation Beam Position and EmissionCoordination System. Alternatively, skilled persons will appreciate thatlaser controller 160 may be used for extracavity modulation of laserenergy via an E-O or an A-O device 106 and/or may optionally instructone or more subcontrollers 164 that control Q-switch 86 or gating device106. Beam positioning system 62 may alternatively or additionally employthe improvements or beam positioners described in U.S. Pat. No.5,751,585 of Cutler et al. or U.S. Pat. No. 6,430,465 B2 of Cutler,which are assigned to the assignee of this application. Other fixedhead, fast positioner head such as galvanometer, piezoelectrically, orvoice coil-controlled mirrors, or linear motor driven conventionalpositioning systems or those employed in the 9300 or 9000 model seriesmanufactured by Electro Scientific Industries, Inc. (ESI) of Portland,Oreg. could also be employed.

With reference again to FIGS. 3-5, in some embodiments, each set 50 oflaser pulses 52 is preferably a burst of ultrashort laser pulses 52,which are generally shorter than 25 ps, preferably shorter than or equalto 10 ps, and most preferably from about 10 ps to 100 fs or shorter. Thelaser pulse widths are preferably shorter than 10 ps because materialprocessing with such laser pulses 52 is believed to be a nonthermalprocess unlike material processing with laser pulses of longer pulsewidths.

During a set 50 of ultrashort laser pulses 52, each laser pulse 52 pitsoff a small part or sublayer of the passivation layer 44 and/or linkmaterial needed to be removed without generating significant heat inlink structure 36 or IC device 12. Due to its extremely short pulsewidth, each pulse exhibits high laser energy intensity that causesdielectric breakdown in conventionally transparent passivationmaterials. Each laser pulse breaks off a thin sublayer of, for example,about 1,000-2,000 Å of overlying passivation layer 44 until overlyingpassivation layer 44 is removed. Consecutive ultrashort laser pulses 52ablate metallic link 22 in a similar layer by layer manner. Forconventionally opaque material, each ultrashort pulse 52 ablates asublayer having a thickness comparable to the absorption depth of thematerial at the wavelength used. The absorption or ablation depth persingle ultrashort laser pulse for most metals is about 100-300 Å.

Although in many circumstances a wide range of energies per ultrashortlaser pulse 52 will yield substantially similar severing depths, in apreferred embodiment, each ultrashort laser pulse 52 ablates about a0.02-0.2 μm depth of material within spot size 40. When ultrashortpulses are employed, preferred sets 50 include 2 to 20 ultrashort pulses52.

In addition to the “nonthermal” and well-controllable nature ofultrashort laser processing, some common ultrashort laser sources are atwavelengths of around 800 nm and facilitate delivery of a small-sizedlaser spot. Skilled persons will appreciate, however, that thesubstantially nonthermal nature of material interaction with ultrashortpulses 52 permits IR laser output be used on links 22 that are narrowerwithout producing an irregular unacceptable explosion pattern. Skilledpersons will also appreciate that due to the ultrashort laser pulsewidth and the higher laser intensity, a higher laser frequencyconversion efficiency can be readily achieved and employed.

With reference FIGS. 9-16, in some embodiments, each set 50 preferablyincludes 2 to 10 pulses 52, which are preferably in the range of about0.1 ps to about 30 ns and more preferably from about 25 ps to 30 ns orranges in between such as from about 100 ps to 10 ns or from 5 ns to 20ns. These typically smaller sets 50 of laser pulses 52 may be generatedby additional methods and laser system configurations. For example, withreference to FIG. 9, the energy densities of pulses 52 d of set 50 d canaccomplished with a simultaneously Q-switched and CW mode-locked lasersystem 60 (FIG. 6).

FIG. 10A depicts an energy density profile of typical laser output froma conventional laser used for link blowing. FIG. 10B depicts an energydensity profile of a set 50 e of laser pulses 52 e ₁ and 52 e ₂ emittedfrom a laser system 60 (with or without mode-locking) that has astep-controlled Q-switch 86. Skilled persons will appreciate that theQ-switch can alternatively be intentionally misaligned for generatingmore than one laser pulse 52. Set 50 e depicts one of a variety ofdifferent energy density profiles that can be employed advantageously tosever links 22 of link structures 36 having different types andthicknesses of link or passivation materials. The shape of set 50 c canalternatively be accomplished by programming the voltage to an E-O orA-O gating device or by employing and changing the rotation of apolarizer.

FIG. 11 is a power versus time graph of an exemplary RF signal 54applied to a step-controlled Q-switch 86. Unlike typical laserQ-switching which employs an all or nothing RF signal and results in asingle laser pulse (typically elimination of the RF signal allows thepulse to be generated) to process a link 22, step-controlled Q-switchingemploys one or more intermediate amounts of RF signal 54 to generate oneor more quickly sequential pulses 52 e ₃ and 52 e ₄, such as shown inFIG. 12, which is a power versus time graph.

With reference to FIGS. 11 and 12, RF level 54 a is sufficient toprevent generation of a laser pulse 52 e. The RF signal 54 is reduced toan intermediate RF level 54 b that permits generation of laser pulse 52e ₃, and then the RF signal 54 is eliminated to RF level 54 c to permitgeneration of laser pulse 52 e ₄. The step-control Q-switching techniquecauses the laser pulse 52 e ₃ to have a peak-instantaneous power that islower than that of a given single unstepped Q-switched laser pulse andallows generation of additional laser pulse(s) 52 e ₄ ofpeak-instantaneous powers that are also lower than that of the givensingle unstepped Q-switched laser pulse. The amount and duration of RFsignal 54 at RF level 54 b can be used to control the peak-instantaneouspowers of pulses 52 e ₃ and 52 e ₄ as well as the time offset betweenthe laser pulses 52 in each set 50. More that two laser pulses 52 e canbe generated in each set 50 e, and the laser pulses 52 e may have equalor unequal amplitudes within or between sets 50 e by adjusting thenumber of steps and duration of the RF signal 54.

FIG. 13 is a simplified schematic diagram of an alternative embodimentof a laser system 60 b employing a Q-switched laser 64 b (with orwithout CW-mode-locking) and having an optical delay path 170 thatdiverges from beam path 120, for example. Optical delay path 170preferably employs a beam splitter 172 positioned along beam path 120.Beam splitter 172 diverts a portion of the laser light from beam path120 and causes a portion of the light to propagate along beam path 120 aand a portion of the light to propagate along optical delay path 170 toreflective mirrors 174 a and 174 b, through an optional half wave plate176 and then to combiner 178. Combiner 178 is positioned along beam path120 downstream of beam splitter 172 and recombines the optical delaypath 170 with the beam path 120 a into a single beam path 120 b. Skilledpersons will appreciate that optical delay path 170 can be positioned ata variety of other locations between laser 64 b and link structure 36,such as between output coupling mirror 78 and optical component 116 andmay include numerous mirrors 174 spaced by various distances.

FIGS. 14A-14D show respective power versus time graphs of exemplarylaser pulses 52 f propagating along optical paths 120, 120 a, 120 b, and170 of the laser system 60 b shown in FIG. 13. With reference to FIGS.13 and 14A-14D, FIG. 14A shows the power versus time graph of a laseroutput 96 propagating along beam path 120. Beam splitter 172 preferablysplits laser output 96 into equal laser pulses 52 f of FIGS. 14B and 52f ₂ of FIG. 14C (generically laser pulses 52 f), which respectivelypropagate along optical path 120 a and optical delay path 170. Afterpassing through the optional half wave plate 176, laser pulse 52 f ₂passes through combiner 178 where it is rejoined with laser pulse 52 f ₁propagate along optical path 120 b. FIG. 14D shows the resultant powerversus time graph of laser pulses 52 f, and 52 f ₂ propagating alongoptical path 120 b. Because optical delay path 170 is longer than beampath 120 a, laser pulse 52 f ₂ occurs along beam path 120 b at a timelater than 52 f ₁.

Skilled persons will appreciate that the relative power of pulses 52 canbe adjusted with respect to each other by adjusting the amounts ofreflection and/or transmission permitted by beam splitter 172. Suchadjustments would permit modulated profiles such as those discussed orpresented in profiles 50 c. Skilled persons will also appreciate thatthe length of optical delay path 170 can be adjusted to control thetiming of respective pulses 52 f. Furthermore, additional delay paths ofdifferent lengths and/or of dependent nature could be employed tointroduce additional pulses at a variety of time intervals and powers.

Skilled persons will appreciate that one or more optical attenuators canbe positioned along common portions of the optical path or along one orboth distinct portions of the optical path to further control thepeak-instantaneous power of the laser output pulses. Similarly,additional polarization devices can be positioned as desired along oneor more of the optical paths. In addition, different optical paths canbe used to generate pulses 52 of different spot sizes within a set 50.

FIG. 15 is a simplified schematic diagram of an alternative embodimentof a laser system 60 c that employs two or more lasers 64 c ₁ and 64 c ₂(generally lasers 64) to implement the present invention, and FIGS.16A-16C show respective power versus time graphs of an exemplary laserpulses 52 g ₁ and 52 g ₂ (generically 52 g) propagating along opticalpaths 120 c, 120 d, and 120 e of laser system 60 c shown in FIG. 15.With reference to FIGS. 15 and 16A-16C, lasers 64 are preferablyQ-switched (preferably not CW mode-locked) lasers of types previouslydiscussed or well-known variations and can be of the same type ordifferent types. Skilled persons will appreciate that lasers 64 arepreferably the same type and their parameters are preferably controlledto produce similar spot sizes, pulse energies, and peak powers. Lasers64 can be triggered by synchronizing electronics 180 such that the laseroutputs are separated by a desired or programmable time interval. Apreferred time interval includes about 5 ns to about 1,000 ns.

Laser 64 c ₁ emits laser pulse 52 g ₁ that propagates along optical path120 c and then passes through a combiner 178, and laser 64C₂ emits laserpulse 52 g ₂ that propagates along optical path 120 d and then passesthrough an optional half wave plate 176 and the combiner 178, such thatboth laser pulses 52 g ₁ and 52 g ₂ propagate along optical path 120 ebut are temporally separated to produce a set 50 g of laser pulses 52 ghaving a power versus time profile shown in FIG. 16C.

With respect to all the embodiments, preferably each set 50 severs asingle link 22. In most applications, the energy density profile of eachset 50 is identical. However, when a work piece 12 includes differenttypes (different materials or different dimensions) of links 22, then avariety of energy density profiles (heights and lengths and as well asthe shapes) can be applied as the positioning system 62 scans over thework piece 12.

In view of the foregoing, link processing with sets 50 of laser pulses52 offers a wider processing window and a superior quality of severedlinks than does conventional link processing without sacrificingthroughput. The versatility of pulses 52 in sets 50 permits bettertailoring to particular link characteristics.

Because each laser pulse 52 in the laser pulse set 50 has less laserenergy, there is less risk of damaging the neighboring passivation andthe silicon substrate 42. In addition to conventional link blowing IRlaser wavelengths, laser wavelengths shorter than the IR can also beused for the process with the added advantage of smaller laser beam spotsize, even though the silicon wafer's absorption at the shorter laserwavelengths is higher than at the conventional IR wavelengths. Thus, theprocessing of narrower and denser links is facilitated. This better linkremoval resolution permits links 22 to be positioned closer together,increasing circuit density. Although link structures 36 can haveconventional sizes, the link width 28 can, for example, be less than orequal to about 0.5 μm.

Similarly, passivation layers 44 above or below the links 22 can be madewith material other than the traditional SiO2 and SiN, such as the low kmaterial, or can be modified if desirable to be other than a typicalheight since the sets 50 of pulses 52 can be tailored and since there isless damage risk to the passivation structure. In addition,center-to-center pitch 32 between links 22 processed with sets 50 oflaser pulses 52 can be substantially smaller than the pitch 32 betweenlinks 22 blown by a conventional IR laser beam-severing pulse. Link 22can, for example, be within a distance of 2.0 μm or less from otherlinks 22 or adjacent circuit structures 34.

It will be obvious to those having skill in the art that many changesmay be made to the details of the above-described embodiment of thisinvention without departing from the underlying principles thereof. Thescope of the present invention should, therefore, be determined only bythe following claims.

1. A method for laser severing a conductive link in an integratedcircuit (IC), the method comprising: providing position datarepresentative of locations of one or more conductive links; generatingat least two laser pulses, the laser pulses including a first laserpulse and a second laser pulse, each of the first and second laserpulses producing a laser spot at the integrated circuit; and directing,based on the position data, the laser pulses to a selected conductivelink to sever the selected conductive link, wherein the laser spots arein movement relative to the selected conductive link while the laserpulses are directed to the selected conductive link, the first andsecond laser pulses are sequentially directed to the selected conductivelink, and at least one of the first and second laser pulses removes adepth of link material that is less than the link thickness.
 2. Themethod of claim 1, wherein the step of directing the laser pulsesincludes providing a focusing lens that is in relative movement withrespect to the selected conductive link while the laser pulses aredirected to the selected conductive link.
 3. The method of claim 1,comprising directing the laser pulses through a gating device.
 4. Themethod of claim 1, wherein the selected conductive link comprises a linkof a memory device or a logic device.
 5. The method of claim 1, whereina passivation layer overlies the selected conductive link.
 6. The methodof claim 1, wherein a burst comprising the laser pulses has a width lessthan 500 ns.
 7. The method of claim 6, wherein the burst comprises morethan two laser pulses.
 8. The method of claim 1, wherein the secondlaser pulse starts after the end of the first laser pulse.
 9. The methodof claim 1, wherein each of the laser pulses has energy characteristics,and the number of laser pulses and the energy characteristics of each ofthe laser pulses are determined as a function of the thickness of theselected conductive link to be severed.
 10. The method of claim 1,wherein the selected conductive link has a width less than or equal toabout 1 μm.
 11. The method of claim 1, wherein the step of generatingthe laser pulses is performed using a mode locked laser.
 12. The methodof claim 1, wherein the step of directing the laser pulses to theselected conductive link includes producing first and second laser spotsof the first and second laser pulses, respectively, that overlap at theselected conductive link.
 13. The method of claim 1, wherein each of thefirst and second laser pulses has a single peak pulse shape.
 14. Themethod of claim 1, wherein the laser pulses have an ultraviolet (UV) ornear UV wavelength.
 15. The method of claim 1, wherein a spot size of atleast one of the laser pulses is greater than a width of the selectedconductive link.
 16. The method of claim 1, wherein the step ofgenerating the laser pulses is performed using a Q-switched laser. 17.The method of claim 1, wherein the step of generating the laser pulsesincludes using an A-O, Q-switched, solid-state laser having an A-OQ-switch that is step controlled such that an RF signal to the Q-switchis reduced from a high power level to an intermediate level to generatethe first laser pulse, and the RF signal to the Q-switch is reduced fromthe intermediate RF level to a smaller RF level to generate the secondlaser pulse.
 18. The method of claim 1, wherein at least one of thelaser pulses has a pulse width of less than 25 picoseconds.
 19. Themethod of claim 1, wherein the step of generating the laser pulsescomprises first generating two or more laser pulses and secondgenerating two or more laser pulses to sever respective conductivelinks, wherein the laser pulses in the first and second generating stepshave different energy density profiles.
 20. The method of claim 1,wherein the first and second laser pulses have different energycharacteristics.
 21. The method of claim 1, wherein the first and secondlaser pulses have different energy densities.
 22. The method of claim 1,wherein the step of generating the laser pulses comprises using harmonicconversion.
 23. A method for laser severing a conductive link in anintegrated circuit (IC), the method comprising: providing position datarepresentative of locations of one or more conductive links; generatingat least two laser pulses, the laser pulses including a first laserpulse and a second laser pulse; and directing, based on the positiondata, the laser pulses to a selected conductive link to sever theselected conductive link, wherein the first and second laser pulses aresequentially directed to the selected conductive link, and at least oneof the first and second laser pulses removes a depth of link materialthat is less than the link thickness.
 24. A method for laser severing aconductive link in an integrated circuit (IC), the method comprising:providing position data representative of locations of one or moreconductive links; generating a beam comprising at least two laserpulses, the laser pulses including a first laser pulse and a secondlaser pulse; and directing, based on the position data, the laser pulsesto a selected conductive link to sever the selected conductive link,wherein the selected conductive link and the beam are in relativemovement while the laser pulses are directed to the selected conductivelink, the first and second laser pulses are sequentially directed to theselected conductive link, and at least one of the first and second laserpulses removes a depth of link material that is less than the linkthickness.